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IC Adapters

Compare Image Name Manufacturer Pricing(USD) ECAD Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Mounting Type Operating Temperature Insulation Resistance Lead Length JESD-609 Code Number of Rows PCB Contact Pattern Contact Style Feature Pitch Current Rating (Amps) Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
84-652000-10 84-652000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder EAR99 84 Non-RoHS Compliant 1A 84 UL 94V-0 Through Hole 3.175mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
20-354000-20 20-354000-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 20 ROHS3 Compliant UL94 V-0 Gold, Tin 3A 20 STANDARD: UL 94V-0 Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
1106396-28 1106396-28 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Correct-A-Chip® 1106396 yes Active 1 (Unlimited) Solder 28 EAR99 Gold 28 35.6mm ROHS3 Compliant Lead Free Copper Gold, Tin SOCKET ADAPTER No SVHC 2.54mm 2.29mm Through Hole e3 2 RECTANGULAR RND PIN-SKT 3A UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
44-505-110 44-505-110 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 505 Active 1 (Unlimited) Solder EAR99 44 Non-RoHS Compliant 44 SOCKET ADAPTER Through Hole 3.81mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
68-652000-11-RC 68-652000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 yes Active 1 (Unlimited) Solder EAR99 68 ROHS3 Compliant 1A 68 UL 94V-0 Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
28-652000-10 28-652000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2011 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 28 Non-RoHS Compliant Lead Free Tin 1A 28 UL 94V-0 1.58mm Through Hole e0 2 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
24-35W000-10 24-35W000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2003 Correct-A-Chip® 35W000 Active 1 (Unlimited) Solder EAR99 24 30.5mm Non-RoHS Compliant Lead Free 24 SOIC 1.58mm Through Hole e0 IC SOCKET 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
1111841-8 1111841-8 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole 2006 Correct-A-Chip® 1111841 Active 1 (Unlimited) Solder EAR99 105°C -55°C 8 Non-RoHS Compliant Tin 8 UL 94V-0 Through Hole 3.175mm e0 2 IC SOCKET 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm MSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
232-1285-29-0602J 232-1285-29-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 32 150°C -55°C Female Gold 32 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 32 Through Hole -55°C~125°C 1GOhm Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
28-650000-11-RC-P 28-650000-11-RC-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 650000 Active 1 (Unlimited) Solder Gold ROHS3 Compliant Gold 28 Through Hole 3.175mm 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
32-655000-10-P 32-655000-10-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 655000 Active 1 (Unlimited) Solder EAR99 Silver Non-RoHS Compliant 32 Through Hole 3.175mm IC SOCKET 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm TSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
68-653000-11-RC 68-653000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 653000 yes Active 1 (Unlimited) Solder EAR99 68 ROHS3 Compliant UL94 V-0 1A 68 UL 94V-0 Through Hole 3.175mm e4 Socket Included UL94 V-0 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
97-AQ132D 97-AQ132D Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2009 Correct-A-Chip® 97-AQ132D Active 1 (Unlimited) Solder EAR99 Gold 132 34.3mm Non-RoHS Compliant Lead Free Tin 132 SOCKET ADAPTER 1.27mm 1.58mm Through Hole e0 1 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm PQFP PGA FR4 Epoxy Glass
24-650000-11-RC 24-650000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2009 Correct-A-Chip® 650000 yes Active 1 (Unlimited) Solder EAR99 Gold 24 30.5mm ROHS3 Compliant Lead Free 24 SOCKET ADAPTER 1.58mm Through Hole e4 IC SOCKET 0.050 1.27mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
228-4817-09-0602J 228-4817-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Female Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.4 (10.16mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing
08-350000-10-HT 08-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks POLYAMIDE 2006 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder EAR99 Tin 8 Non-RoHS Compliant 8 2.54mm Through Hole e0 2 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
LCQT-QFP0.65-52 LCQT-QFP0.65-52 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C Non-RoHS Compliant UL94 V-0 Lead Free 52 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.026 0.65mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
PA-SOD6SM18-44 PA-SOD6SM18-44 Logical Systems Inc. 0.0000
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0.00000000 7 Weeks Active Not Applicable Solder RoHS Compliant 44 Through Hole 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm SOIC DIP
16-307349-11-RC-P (170 UP) 16-307349-11-RC-P (170 UP) Aries Electronics 0.0000
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0.00000000 download 5 Weeks Correct-A-Chip® 307349 Active 1 (Unlimited) Solder Gold ROHS3 Compliant 16 Through Hole 0.050 1.27mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
228-1277-29-0602J 228-1277-29-0602J Artery 0.0000
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Min: 1

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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
28-35W000-11-RC 28-35W000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 35W000 yes Active 1 (Unlimited) Solder EAR99 28 ROHS3 Compliant Lead Free 28 SOCKET ADAPTER SOIC Through Hole 3.175mm e4 IC SOCKET Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.050 1.27mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
20-301550-20 20-301550-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 301550 Active 1 (Unlimited) Solder EAR99 32 Non-RoHS Compliant 20 SOCKET ADAPTER Through Hole 2.286mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.090 2.29mm 0.100 2.54mm SOIC PLCC FR4 Epoxy Glass
16-354000-10 16-354000-10 Aries Electronics 0.0000
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0.00000000 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2012 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 Gold 16 Non-RoHS Compliant UL94 V-0 Tin 3A 16 STANDARD: UL 94V-0 Surface Mount 105°C e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
248-1282-39-0602J 248-1282-39-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2009 Textool™ Active 1 (Unlimited) Wire Wrap 48 150°C -55°C Female Gold 48 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 48 Through Hole -55°C~125°C 1GOhm Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
32-653000-10 32-653000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2011 Correct-A-Chip® 653000 Active 1 (Unlimited) Solder EAR99 32 40.6mm Non-RoHS Compliant Contains Lead 32 UL 94V-0 6.08mm Through Hole e0 Socket Included 1A UL94 V-0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
24-651000-10 24-651000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 36 Non-RoHS Compliant 1A 24 SOCKET ADAPTER Through Hole 3.683mm e0 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
24-354000-21-RC 24-354000-21-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 24 ROHS3 Compliant UL94 V-0 3A 24 STANDARD: UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
97-56001 97-56001 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2010 Correct-A-Chip® 97-56001 Active 1 (Unlimited) Solder 144 Gold 132 Non-RoHS Compliant Contains Lead 169 SOCKET ADAPTER Through Hole 3.175mm e3 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
14-350000-10-HT 14-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole POLYAMIDE 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder EAR99 Tin 14 Non-RoHS Compliant 14 SOCKET ADAPTER Through Hole 3.175mm High Temperature IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
18-666000-00 18-666000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 666000 Active 1 (Unlimited) Solder EAR99 18 Non-RoHS Compliant 18 UL 94V-0 Surface Mount 2.032mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.080 2.03mm 0.050 1.27mm SOIC SOWIC FR4 Epoxy Glass
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