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IC Adapters

Compare Image Name Manufacturer Pricing(USD) ECAD Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Material Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Voltage - Rated Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Width Mounting Type Weight Operating Temperature Insulation Resistance Lead Length JESD-609 Code Body Material Body Breadth Number of Rows PCB Contact Pattern Body Depth Contact Style Feature Pitch Current Rating (Amps) Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
16-354000-21-RC 16-354000-21-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 16 ROHS3 Compliant UL94 V-0 3A 16 STANDARD: UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
28-651000-10 28-651000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 28 35.6mm Non-RoHS Compliant Contains Lead 28 SOCKET ADAPTER 1.58mm Through Hole e3 1A IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
44-652000-10 44-652000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 44 Non-RoHS Compliant Lead Free Tin 1A 44 UL 94V-0 Through Hole 3.175mm e0 2 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
232-1285-19-0602J 232-1285-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 32 150°C -55°C Female Gold 32 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 32 Through Hole 453.59237g -55°C~125°C 1GOhm Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
264-4493-09-0602J 264-4493-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 64 150°C -55°C Female Gold Straight 6.9mm 64 100.3mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1kV 1A 64 43.2mm Through Hole -55°C~125°C Glass, Polysulfone 2.54mm 1A UL94 V-0 22.86 mm 0.070 1.78mm Gold 30.0μin 0.76μm 300.0μin 7.62μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.070 1.78mm DIP, 0.9 (22.86mm) Row Spacing DIP, 0.9 (22.86mm) Row Spacing
24-665000-00 24-665000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder EAR99 24 Non-RoHS Compliant 24 Surface Mount 787.4μm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
84-652000-11-RC 84-652000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 yes Active 1 (Unlimited) Solder EAR99 84 ROHS3 Compliant 1A 84 UL 94V-0 Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
48-6645-18 48-6645-18 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 6645 Active 1 (Unlimited) Solder EAR99 48 Non-RoHS Compliant 48 ADAPTER Through Hole e3 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm TQFP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
242-1281-39-0602J 242-1281-39-0602J Artery 0.0000
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0.00000000 download Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Obsolete 1 (Unlimited) Wire Wrap 42 150°C -55°C Gold 42 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 42 Through Hole -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
248-1282-19-0602J 248-1282-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 48 150°C -55°C Female Gold 48 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 48 Through Hole -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
14-354000-11-RC 14-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyester Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant UL94 V-0 Copper 3A 14 STANDARD: UL 94V-0 No SVHC Surface Mount 762μm e4 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
224-1275-19-0602J 224-1275-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Wire Wrap 24 150°C -55°C Female Gold Straight 6.9mm 24 45mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1kV 1A 24 32mm Through Hole 453.59237g -55°C~125°C Glass, Polysulfone Closed Frame 2.54mm 1A UL94 V-0 15.24 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
224-1275-39-0602J 224-1275-39-0602J Artery 0.0000
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Min: 1

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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2006 Textool™ Active 1 (Unlimited) Solder 24 150°C -55°C Female Gold 24 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 24 Through Hole 453.59237g -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
1109252 1109252 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole 2006 Correct-A-Chip® 1109252 Active 1 (Unlimited) Solder 56 EAR99 56 Non-RoHS Compliant 28 Through Hole 3.175mm e3 IC SOCKET Tin-Lead Brass 0.125 3.18mm 0.070 1.78mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
18-35W000-10 18-35W000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2003 Correct-A-Chip® 35W000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 18 22.9mm Non-RoHS Compliant Lead Free 18 1.58mm Through Hole IC SOCKET 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
24-354000-20 24-354000-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 24 ROHS3 Compliant UL94 V-0 Gold, Tin 3A 24 STANDARD: UL 94V-0 Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
08-666000-00 08-666000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 666000 Active 1 (Unlimited) Solder EAR99 8 Non-RoHS Compliant 8 UL 94V-0 Surface Mount 2.032mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.080 2.03mm 0.050 1.27mm SOIC SOWIC FR4 Epoxy Glass
32-650000-10-P 32-650000-10-P Aries Electronics 0.0000
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0.00000000 5 Weeks 2013 Correct-A-Chip® 650000 Active 1 (Unlimited) Solder Non-RoHS Compliant 32 SOIC Through Hole 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
95-132I25-P 95-132I25-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 95-132I25 Active 1 (Unlimited) Solder EAR99 Tin 132 Non-RoHS Compliant 132 SOCKET ADAPTER Through Hole 3.175mm e3 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
24-354000-10 24-354000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 24 ROHS3 Compliant UL94 V-0 Gold, Tin 3A 24 STANDARD: UL 94V-0 Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
228-1290-09-0602J 228-1290-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Female Gold Straight 6.9mm 28 40.5mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 27.9mm Through Hole -55°C~125°C 1GOhm Glass, Polysulfone 1.78mm 1A UL94 V-0 10.16 mm 0.070 1.78mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.070 1.78mm DIP, 0.4 (10.16mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing
1107254-24 1107254-24 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder 24 EAR99 Gold 24 30.5mm ROHS3 Compliant Lead Free Copper SOCKET ADAPTER No SVHC 2.54mm 2.29mm Through Hole e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 3A UL94 V-0 15.24 mm IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
264-4493-19-0602J 264-4493-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 64 150°C -55°C Gold 43.2mm 64 100.3mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 64 6.9mm Through Hole -55°C~125°C 1GOhm 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.9 (22.86mm) Row Spacing DIP, 0.9 (22.86mm) Row Spacing
32-652000-10 32-652000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2007 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder EAR99 32 40.6mm Non-RoHS Compliant 32 UL 94V-0 1.58mm Through Hole e0 1A IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
36-651000-10 36-651000-10 Aries Electronics 0.0000
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0.00000000 download 6 Weeks 2012 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 Tin 36 Non-RoHS Compliant 36 SOCKET ADAPTER Through Hole 105°C e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
14-35W000-10 14-35W000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2003 Correct-A-Chip® 35W000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 14 17.8mm Non-RoHS Compliant Lead Free 14 SOIC 1.58mm Through Hole IC SOCKET 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
20-350001-11-RC 20-350001-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2007 Correct-A-Chip® 350000 yes Active 1 (Unlimited) Solder EAR99 GOLD (10) OVER NICKEL (100) 20 25.4mm ROHS3 Compliant Lead Free 20 SOCKET ADAPTER SOIC 1.58mm Through Hole e4 IC SOCKET 0.050 1.27mm Tin 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
44-653000-10 44-653000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2007 Correct-A-Chip® 653000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 44 Non-RoHS Compliant Contains Lead Tin 1A 44 UL 94V-0 1.58mm Through Hole e0 2 Socket Included UL94 V-0 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
248-1282-09-0602J 248-1282-09-0602J Artery 0.0000
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Min: 1

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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 48 150°C -55°C Female Gold 48 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 48 Through Hole -55°C~125°C 1GOhm Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
24-35W000-11-RC 24-35W000-11-RC Aries Electronics 0.0000
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Min: 1

Mult: 1

0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 35W000 yes Active 1 (Unlimited) Solder EAR99 24 ROHS3 Compliant 24 SOCKET ADAPTER Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
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