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  • STM32F103C8T6
  • MFI343S00177
  • STM32F407VET6
  • ATMEGA328P-PU
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Items : %s%s

Configuration Proms for FPGAs

Additional Feature

  • 4 WIRE INTERFACE TO FLEX 8000 DEVICES
  • ALSO OPERATES AT 5V SUPPLY
  • IT CAN ALSO OPERATE AT 5V SUPPLY
  • IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
  • IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO
  • USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Lead, Tin
  • Tin

ECCN Code

  • 3A001.A.2.C
  • 3A001.B.1.A
  • 3A991.B.1
  • 3A991.B.1.A
  • 3A991.B.1.B.1
  • 3A991.B.2.A
  • EAR99

Factory Lead Time

  • 1 Weeks
  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 25 Weeks
  • 30 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks

HTS Code

  • 8542.32.00.51
  • 8542.32.00.61
  • 8542.32.00.71
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e4

Manufacturer Package Identifier

  • XCF02SVOG20C

Max Operating Temperature

  • 125°C
  • 70°C
  • 85°C

Min Operating Temperature

  • -40°C
  • -55°C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 2 (1 Year)
  • 3
  • 3 (168 Hours)
  • Not Applicable

Mount

  • Surface Mount
  • Through Hole

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Number of Terminals

  • 100

Number of Terminations

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Operating Temperature

  • -40°C~85°C
  • 0°C~70°C

Package / Case

  • 100-BQFP
  • 16-SOIC (0.295, 7.50mm Width)
  • 20-LCC (J-Lead)
  • 20-SOIC (0.295, 7.50mm Width)
  • 20-TSSOP (0.173, 4.40mm Width)
  • 24-LBGA
  • 24-TBGA
  • 32-TQFP
  • 44-LCC (J-Lead)
  • 44-TQFP
  • 48-TFBGA, CSPBGA
  • 48-TFSOP (0.724, 18.40mm Width)
  • 64-TBGA
  • 8-DIP (0.300, 7.62mm)
  • 8-SOIC (0.154, 3.90mm Width)
  • 8-TDFN
  • 88-LFBGA
  • FBGA
  • PDIP
  • PLCC
  • PQFP
  • SOIC

Packaging

  • Bulk
  • Tray
  • Tube

Part Status

  • Active
  • Discontinued
  • Obsolete

Pbfree Code

  • no
  • yes

Published

  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2010
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Series

  • EPC
  • EPCQ
  • EPCQ-A
  • EPCQ-L
  • EPCS
  • EPCV

Subcategory

  • Flash Memories
  • OTP ROMs

Supplier Device Package

  • 100-PQFP (20x14)
  • 16-SOIC
  • 20-PLCC (9x9)
  • 20-SOIC
  • 20-TSSOP
  • 32-TQFP (7x7)
  • 44-PLCC (16.6x16.6)
  • 44-TQFP (10x10)
  • 8-LAP
  • 8-LAP (6x6)
  • 8-PDIP
  • 8-SOIC
  • 8-TSOP
  • 88-UBGA (11x8)

Surface Mount

  • NO
  • YES

Technology

  • CMOS
  • MOS

Terminal Finish

  • MATTE TIN
  • MATTE TIN (472) OVER COPPER
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • NICKEL (39) PALLADIUM (2) GOLD
  • NICKEL PALLADIUM GOLD
  • Nickel/Gold (Ni/Au)
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • TIN LEAD
  • TIN SILVER COPPER
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn63Pb37)
  • Tin/Lead (Sn85Pb15)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Termination

  • SMD/SMT
  • Through Hole

Type

  • NOR TYPE

Weight

  • 1.758804g
  • 540.001716mg
  • 665.986997mg
  • 722.005655mg
  • 930.006106mg
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    Compare Image Name Manufacturer Pricing(USD) ECAD Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Published Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code Max Operating Temperature Min Operating Temperature Operating Supply Voltage Length RoHS Status Radiation Hardening Number of Pins Package / Case Reach Compliance Code Density Width Technology Operating Mode Height Seated (Max) HTS Code Number of Functions JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Pin Count Temperature Grade Surface Mount Terminal Pitch Supply Voltage-Min (Vsup) Operating Temperature (Max) Operating Temperature (Min) Subcategory Qualification Status Power Supplies Supply Voltage-Max (Vsup) Output Characteristics Memory Size Supply Current-Max Organization Memory Width Memory Density Memory IC Type Parallel/Serial Clock Frequency Standby Current-Max Access Time (Max) I/O Type
    XQ17V16VQ44N XQ17V16VQ44N Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 no 3 44 3A001.A.2.C 10mm Non-RoHS Compliant 44 not_compliant 10mm CMOS SYNCHRONOUS 1.2mm 8542.32.00.51 1 e0 Tin/Lead (Sn85Pb15) QUAD GULL WING 225 3.3V 30 44 MILITARY YES 0.8mm 3V 125°C -55°C OTP ROMs Not Qualified 3.3V 3.6V 3-STATE 0.1mA 2MX8 8 16777216 bit CONFIGURATION MEMORY PARALLEL/SERIAL 33MHz 0.001A 20 ns COMMON
    XC18V04VQ44C0100 XC18V04VQ44C0100 Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks 1999 Non-RoHS Compliant
    XC18V01PC20C0100 XC18V01PC20C0100 Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 18 Weeks 1999 Non-RoHS Compliant
    XQ17V16CC44M XQ17V16CC44M Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 25 Weeks 1998 no Discontinued 44 3A001.A.2.C 125°C -55°C 16.51mm Non-RoHS Compliant 44 16.51mm CMOS SYNCHRONOUS 4.826mm 8542.32.00.51 1 e0 Tin/Lead (Sn/Pb) QUAD J BEND NOT SPECIFIED 3.3V NOT SPECIFIED 44 MILITARY YES 1.27mm 3V OTP ROMs Not Qualified 3.3V 3.6V 3-STATE 2MB 0.1mA 2MX8 8 16777216 bit CONFIGURATION MEMORY PARALLEL/SERIAL 33MHz 0.001A 20 ns COMMON
    XC18V01SO20C0100 XC18V01SO20C0100 Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 30 Weeks 1999 70°C 0°C 3.3V RoHS Compliant No SOIC 1 Mb
    XC18V01PCG20C0100 XC18V01PCG20C0100 Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 18 Weeks 1999 85°C -40°C 3.3V RoHS Compliant PLCC 1 Mb
    XQ17V16-DIE0628 XQ17V16-DIE0628 Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 Non-RoHS Compliant
    XC18V02PCG44C0100 XC18V02PCG44C0100 Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 18 Weeks 1999 85°C -40°C 3.3V RoHS Compliant No PLCC 2 Mb
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