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XC7Z010-1CLG400C

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Manufacturer No:

XC7Z010-1CLG400C

Manufacturer:

Xilinx

HK JDW NO:

903-XC7Z010-1CLG400C

Package:

400-LFBGA, CSPBGA

Datasheet:

XC7Z010-1CLG400C

ECAD Model:

Description:

400 Terminations0°C~85°C TJ 400 Pin XC7Z010 System On ChipZynq?-7000 Series 130 I/O1V

Quantity:

In Stock : 2160

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Product Details

Purchasing and Inquiry

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.The manufacturer assigns this system on a chip with a 400-LFBGA, CSPBGA package as per the manufacturer's specifications.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Zynq?-7000 is the series in which this system on chip SoC falls under.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.As one of the most important things to note is that this SoC security combines Artix?-7 FPGA, 28K Logic Cells together.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.Use a power supply with a voltage of 1V if possible.In the SoCs wireless, voltages above 1.05V are considered unsafe.The system on a chip uses 400 terminations in total.Searching XC7Z010 will bring up system on chips with similar specs and purposes.The wireless SoC works at a frequency of 667MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 400.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z010-1CLG400C System On Chip (SoC) applications.

  • Communication network-on-Chip (cNoC)
  • AC-input BLDC motor drive
  • Medical
  • Self-aware system-on-chip (SoC)
  • Embedded systems
  • Industrial transport
  • Communication interfaces ( I2C, SPI )
  • Automotive
  • Digital Media
  • Test and Measurement
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XC7Z010-1CLG400C

technical specifications, attributes, parameters and parts with similar specifications to XC7Z010-1CLG400C.

  • Type
    Parameter
    Select All
  • Bus Compatibility

    CAN; ETHERNET; I2C; SPI; UART; USB

  • Architecture

    MCU, FPGA

  • Peripherals

    DMA

  • RAM (words)

    256000

  • Primary Attributes

    Artix™-7 FPGA, 28K Logic Cells

  • Speed Grade

    -1

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Factory Lead Time

    10 Weeks

  • Packaging

    Tray

  • Published

    2010

  • Series

    Zynq®-7000

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    400

  • ECCN Code

    EAR99

  • Operating Supply Voltage

    1V

  • Length

    17mm

  • RoHS Status

    ROHS3 Compliant

  • Contact Plating

    Copper, Silver, Tin

  • Radiation Hardening

    No

  • Number of Pins

    400

  • Package / Case

    400-LFBGA, CSPBGA

  • Interface

    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

  • Frequency

    667MHz

  • Operating Temperature

    0°C~85°C TJ

  • Technology

    CMOS

  • Height Seated (Max)

    1.6mm

  • HTS Code

    8542.39.00.01

  • JESD-609 Code

    e1

  • Terminal Finish

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    260

  • Supply Voltage

    1V

  • Base Part Number

    XC7Z010

  • Surface Mount

    YES

  • Terminal Pitch

    0.8mm

  • Supply Voltage-Max (Vsup)

    1.05V

  • Core Architecture

    ARM

  • Core Processor

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • RAM Size

    256KB

  • Number of I/O

    130

  • Boundary Scan

    YES

  • Data Bus Width

    32b

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